JPH02131394U - - Google Patents
Info
- Publication number
- JPH02131394U JPH02131394U JP4036689U JP4036689U JPH02131394U JP H02131394 U JPH02131394 U JP H02131394U JP 4036689 U JP4036689 U JP 4036689U JP 4036689 U JP4036689 U JP 4036689U JP H02131394 U JPH02131394 U JP H02131394U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- circuit board
- thick film
- integrated circuit
- film integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4036689U JPH02131394U (en]) | 1989-04-04 | 1989-04-04 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4036689U JPH02131394U (en]) | 1989-04-04 | 1989-04-04 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02131394U true JPH02131394U (en]) | 1990-10-31 |
Family
ID=31550093
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4036689U Pending JPH02131394U (en]) | 1989-04-04 | 1989-04-04 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02131394U (en]) |
-
1989
- 1989-04-04 JP JP4036689U patent/JPH02131394U/ja active Pending